Electronic Components

Gold BUMP

We have been manufacturing high-accuracy and high-quality gold bump for LCD driver and Plasma display driver.
We have various fabrication processes including gold bumping and electro function test process as known as wafer test, and have been offering "turnkey service" for our customer's request.

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Wafer Test

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We can support our customer's LCD driver testing process with our high performance probing test.
We can get faster feedback from testing process for pre-process and gold bumping process.

Solder BUMP

We have been manufacturing environment-friendly lead-free solder bump for MEMS, power supply IC, and more.

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RFID

We have obtained the know-how from LCD driver assembly and have applied it to the RFID assembly.
We are working continuously in antenna designs, IC assemblies, and customized package designs to meet our customer's request.
Moreover, we have been offering total solutions, including software.

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Contact Us

By telephone or FAX

Electronic Components Div.
PHONE. +81-3-3243-6080
FAX. +81-3-3243-6289

On the Internet

By Email
お問い合わせ
Web site
サン・エレクトロニクス株式会社