Exhibition "N plus 2013"

September 20, 2013

JNC Corporation will exhibit thermal management materials e.g., thermal spread sheet and thermal dissipation paint.
The exhibition "N plus 2013" will take place on Sep. 25(wed.)-27(Fri.) in Tokyo Big Sight.
Please visit JNC's booth (2K-08) to discuss thermal problems in your company.

"Expand and diversify your thermal management methods!"
JNC's thermal spread sheet having thinness and three-dimensional workability is applicable to design thermal spread pass for dissipation.
It achieves high cooling property and excellent workability due to three layers laminated structure consist of two metal layers having larger heat transfer capacity and a graphite layer of faster heat spread ability.
Coating with a thermal dissipation paint provides the higher performance of heat dissipation.
JNC offers novel solution for thermal management with the combination of thermal spread sheet and thermal dissipation paint.

Related Information (Website of SUN ELECTRONICS Co., Ltd.)