JISSO PROTEC 2012

June 08, 2012

JNC will exhibit a booth in the "JISSO PROTEC 2012" to be held at Tokyo Big Sight from Wednesday, June 13th to Friday, June 15th. At our booth, we will introduce Printed Electronics Material" and Various Heat Dissipation Materials made by our Company.

[Printed Electronics Material]
We will make a presentation of ink corresponding to inkjet printing as a resin material for printed electronics.
Among the types of materials, thermosetting polyimide ink has excellent insulation and high density which allows thick film formation without using NMP (N-Methyl-2-pyrolidinone), thereby improving the durability of the inkjet head.
Moreover, UV curable ink is absent of solvent. Therefore, thick film formation can be achieved and curing can be made at a lower light exposure.
We will also make a presentation of a surface treatment agent suitable for formation of finer inkjet printing patterns in the upcoming exhibition.

Regarding the polyimide ink and the UV curable ink made by our Company, we will provide the ink with performance characteristics in response to requests from our customers in various applications in the semiconductor fields, printed circuit board fields or the like.
Moreover, the following may be expected from to the inkjet printing method: simplification of processes, printing on corrugated surfaces, reduction of plant and equipment cost, and reduction of environmental load.

[Heat Dissipation Materials]
Related Information (Website of SUN ELECTRONICS Co., Ltd.)


We welcome you to stop by our booth during your visit.